AMD & Samsung Seal AI Chip Deal Over HBM4 Memory
Advanced Micro Devices CEO Lisa Su visited Korea to deepen ties with local tech firms, culminating in a signed Memorandum of Understanding that expands their nearly two-decade collaboration. The agreement specifically commits Samsung Electronics to supply its latest High Bandwidth Memory 4 chips for AMD's next-generation AI GPUs targeting the U.S. market while exploring broader foundry partnerships and cloud infrastructure projects alongside Naver.
Key Points
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1Samsung Electronics has agreed with AMD to supply its latest HBM4 chips specifically designed for AI GPUs.
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2The two tech giants signed a Memorandum of Understanding (MOU) aimed at expanding their strategic collaboration in the global artificial intelligence chip market. This partnership marks nearly twenty years of cooperation between Samsung and AMD, which is now being expanded into new areas like foundry services.
Developments
Perspectives
Samsung Electronics and AMD have solidified a nearly twenty-year collaboration by signing an agreement to supply high bandwidth memory chips for AI GPUs.
— [Mar 18, 06:30] Samsung Elec, AMD sign MoU on AI memory, explore foundry partnership (Tribune.com.pk)"AMD CEO Lisa Su paid her first visit to Korea since taking office in 2014", signaling an intent "to ramp up efforts" amid fierce competition with Nvidia.
— [Mar 18, 06:35] AMD boosts ties during CEO's 1st Korea visit (Feed.koreatimes.co.kr)"Samsung Electronics to supply HMB chips for the U.S. firm [AMD]'s next-generation artificial intelligence infrastructure".
— [Mar 18, 06:35] Samsung Elec & AMD sign MoU on AI memory and explore foundry partnership (Tribune.com.pk)Samsung Electronics has signed an agreement with AMD, expanding their nearly two-decade partnership by supplying next-generation HBM4 memory for AI accelerators and exploring foundry services together. This collaboration also includes developing optimized DDR5 memory to support the upcoming EPYC processors within a new rack-scale architecture designed alongside Nvidia's GTC conference timing.
AMD CEO Lisa Su visited Samsung Electronics in Korea for her first trip since 2014 and signed an agreement designating the company as AMD's primary supplier of HBM4 memory. Under this partnership, which builds on two decades of collaboration including foundry services discussions, both firms aim to accelerate next-generation AI computing through integrated silicon solutions like MI35X GPUs and Venice CPUs.
Samsung Electronics has signed a memorandum with AMD designating itself as the preferred supplier for its first-gen shipment (February) high-bandwidth Memory 6th Gen chips. The deal includes collaboration on HBM4 technology, DDR5 memory solutions, advanced foundry services to support AI computing ecosystems since their partnership began in 2007